Amitron is now the sole supplier of SIPAD solid solder coating services to OEM’s, CEM’s and Printed Circuit Manufacturers in both eutectic and lead free solder versions in North America.
Assembling & Soldering PCBs Just Got Easier
SIPAD is a process that can be added to a finished PCB or array, allowing for easy hand assembly and soldering. The protective paper is simply peeled off, components affixed to the surface, then heat to reflow.
Attaching surface mount devices (SMDs) to printed circuits is a challenge that generates a lot of debate as to what methods work for which users at any given time during the lifetime of a product. There are many methods used to place and fuse SMD components to one or both sides of a printed circuit board. Most concentrate on the high volume throughput needed once the product has been prototyped and tested at the development level. But what about the methods used to assemble prototype quantities, usually in the lab or at small contract manufacturers specializing in small runs? Solid Solder Deposit (SSD) is emerging as a reliable solution to many of the challenges facing this segment of the cycle often overlooked.
SIPAD uses the solder mask to form wells around each surface mount land. The wells have sidewalls that provide solder mask dams between smd pads. Solder paste is applied into the wells using a normal stencil printing operation. After a sufficient amount of paste is applied, the printed circuit board is subjected to a standard reflow. During this initial reflow, the solder paste is fused and a pad or bump is formed with a meniscus above the plane of the solder mask.
At this point the boards are thoroughly washed to remove any solder balls or residue. Because there are no components cleaning is much more efficient.
After washing, the boards are placed into a flattening system, which heats the solder deposit to the melting point and flattens the pads between the platens of a cold press. This process freezes the solder deposits into a SSD planar with all the rest of the smd pads.
Once the SIPAD board is flattened, the same stencil is used to apply adhesive no clean flux to the surface mount pads. This flux was developed especially for SIPAD and is the only product available that is designed to be applied and dried to a tacky finish, then protected by a release paper to maintain the tack. This flux holds the components in place and burns off during the final reflow leaving no noticeable residue.
During the final reflow, the SIPAD returns to the original shape, attaching the component leads in the process.
The solder shape is very predictable during this reflow cycle.
- Convenience – Your printed circuit board prototypes will arrive ready for hand assembly. It’s the easiest and quickest hand assembly you’ll ever experience.
- Time-Savings – Instead of soldering and assembling components one by one, SIPAD will save you time.
- Better Quality – The solder paste is reflowed without a component on top, thus, no chance for a void in the solder joint. Less touchup and rework on those BGA’s and other fancy components.
The SIPAD solid solder deposit process is an alternative to screen printing solder paste during the printed circuit board assembly process. SIPAD solder is “solid solder” with adhesive flux to hold components in place.
SIPAD LF is our lead free version of the SIPAD solid solder deposit. This product is excellent for the transition from leaded to lead free products. Like regular SIPAD boards, SIPAD LF boards come out of the box ready to place parts without stencil printing.
SIPAD MW stands for microwave. These boards break all the soldermask rules for SIPAD ssd application however, microwave designs are becoming more and more popular at Amitron. Creative fixturing allows us to tackle these unusual designs previously thought impossible for the SIPAD solid solder deposit technology.
SIPAD Radio Frequency (RF) boards do not follow traditional solder mask design rules. However, the advantages are numerous putting the right amount of solder in the right place. Careful stencil engineering and experience are the keys to successful SIPAD application
SIPAD VIP is via in pad technology. Amitron has developed different solutions for filling via holes with solder. Size, design and other factors affect which process is used.
One of the most effective ways to demonstrate the capabilities of a SIPAD printed circuit board is to try one for yourself. Amitron offers sample boards that can be assembled in your facility. The SIPAD sample board has numerous surface mount footprints common to many designs, coated with SIPAD solid solder deposit and flux adhesive.
The convenience, time savings, and higher quality, will outweigh any added costs. SIPAD solid solder deposit (ssd) charges are not influenced by layer counts. Charges for SIPAD ssd are based on the following parameters.
Pricing is based on the number of sides, order quantity, technology, and delivery. Boards can be stepped into arrays for more economical pricing. Prices based on standard smd technology and are subject to change based on design. Prices do not include shipping or stencil incoming frieght. See RFQ Notes below for additional specifications.
- Soldermask design conforms to requirements
- Minimum leaded pitch size = .020 (0.5mm)
- Minimum BGA pitch size .030 (1.0mm)
- Piece size <= 8.00 x 10.00
- .125 Tooling holes on boards or in rails
- Board thickness .062
- <= 10 Images per array
- No Via in Pad (VIP) Technology
- Stencil Gerber files provided 1:1
- Prices do not include re-work for bare board defects.
- Rework must be approved in writing. (e-mail accepted)
- Standard lead time; (Expedited Deliveries Available)
- 1-20 pcs 2 days
- 21-50 pcs 2-3 days
- > 50 pcs 2-4 days
SIPAD LF, Lead Free SIPAD ssd
- Notify Amitron as early as possible for lead free SIPAD
- Add 20% to unit price for lead free SIPAD ssd
- One or two side SIPAD application
- Images per panel/array
- Pitch Size
- Type of solder paste specified
- Size of printed circuit board
- Quantity and Delivery